Judit Molera realized a Research stage at Bellapart Company, since 1st Novembre to 5th December 2019, to study the microstructure of the of glass-metal soldering with lead-free alloys.
In conventional soldering, solder materials generally bond with other metals by the formation of an IMC layer at the interface. However, the conventional soldering method cannot form an IMC layer with some materials, such as glass, because the material surface has a thin inert native oxide layer. The chemical stability of the oxide layer is high and thus hinders diffusion of the solder materials. For this reason, it is difficult to bond the solder to materials with an oxide layer.
When ultrasonication is applied to a melted solder, the solder bonds to the glass surface with good wettability.
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